A technology enterprise focusing on the research and development of artificial intelligence chips for edge computing is facing the dilemma of lagging patent layout and insufficient transformation of academic achievements in the research and development of independent architecture chips. The "Heterogeneous Fusion Edge AI Chip Architecture" developed by the company has achieved a breakthrough in increasing computing power density by 50% and reducing power consumption by 30%. It has been applied in scenarios such as intelligent security and industrial detection, but the core architecture design has only applied for 3 patents, which poses a risk of being avoided by competitors; Although the R&D team has accumulated a large amount of technical data, they have not formed high-quality academic papers due to a lack of systematic sorting, making it difficult to establish authoritative discourse power in industry technical exchanges.

After our team's in-depth involvement, we first conducted a comprehensive technical breakdown of the chip architecture. Through multiple rounds of discussions with architects and algorithm engineers, we identified 14 core innovation points, including heterogeneous computing unit interconnection, dynamic power management, and instruction set optimization. In response to the weak patent layout issue, a pyramid shaped patent layout strategy of "architecture core+key modules+application interfaces" has been formulated, focusing on the application of 8 core invention patents for architecture innovation, and 12 peripheral patents for key modules such as computing units and storage architecture, forming a strict patent protection network. Among them, the patent of "a heterogeneous computing resource allocation method based on task scheduling" successfully covers the underlying innovation of the architecture.

In terms of academic paper conversion, guide the R&D team to extract three research directions with academic value from patented technologies, focusing on topics such as "edge AI chip energy efficiency optimization mechanism" and "heterogeneous architecture computing power scheduling algorithm". Assist the team in combining experimental data with patent technology principles, standardizing the structure of the paper, highlighting performance comparisons with existing technologies, and ultimately completing 4 high-level academic papers. Two of them were included in ACM Transactions on Embedded Computing Systems, and one was presented as a poster at the International Solid State Circuit Conference (ISSCC). The paper cleverly cited publicly available patent content as technical support, which not only avoided the leakage of core secrets but also enhanced the credibility of the research.

After the implementation of the project, the coverage of enterprise patent layout increased from 20% to 90%, successfully resisting the architectural imitation behavior of two competitors. After the academic papers were published, the enterprises' technical voice in the field of edge computing chips was significantly improved. They were invited to participate in the formulation of four industry technical standards, and established chip joint laboratories with three universities, obtaining a special R&D fund of 12 million yuan. Based on the technological advantages of patent portfolio, the market share of enterprise chip products has increased from 8% to 22%, with annual sales exceeding 300 million yuan, achieving a dual enhancement of technological protection and industry influence.